ASE's Huang urges AI profits to fund R&D for CPO, PLP

<p class="P1" data-start="2270" data-end="3042">As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from a supporting role in the supply chain to a critical factor in technological breakthroughs. SEMI has announced the formation of the "SEMI Semiconductor Materials Alliance," bringing together 35 materials, equipment, wafer fabrication, packaging, and testing companies, as well as industry, government, academia, and research organizations, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), ASE, and Micron Technology, to speed material validation for emerging technologies such as co-packaged optics (CPO) and panel-level packaging (PLP), with the goal of accelerating mass production.