Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic and customer-specific functions into the HBM base die while SK Hynix focuses on packaging, heat and the challenges of taller memory stacks.
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