Open App →
Back to News Feed
Digitimes August 25, 2026 By Yunnie Cheng neutral

Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon

SK HynixAI / LLMNVIDIA / GPUData Center
On August 20, SK Hynix's global research team published a paper in <em>Nature Electronics</em> detailing its co-packaged optics (CPO) development for high-performance computing (HPC) and AI. Highlighting key technical hurdles and outlining the trajectory for next-generation optical interconnect technology, the paper marks SK Hynix's first systematic presentation of its CPO roadmap.
Read original article ↗

Related Articles

Samsung, SK Hynix step up China NAND upgrades as US tool risks grow

Samsung Electronics and SK Hynix are stepping up equipment spending at their NAND flash plants in China through 2027, up

Digitimes · August 25, 2026

SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip

The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increas

Digitimes · August 25, 2026

Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026

Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM

Digitimes · August 25, 2026

Nvidia memory demand widens the gap between SK Hynix and Samsung

Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026.

Digitimes · August 25, 2026