SK Hynix breaks ground on US$4 billion Indiana plant that will package, not make, HBM
SK hynix broke ground on August 27 on a US$4 billion advanced packaging plant in Purdue Research Park, its first US high-bandwidth memory (HBM) site.
Read original article ↗
Related Articles
SK Hynix weighs closer ties with Kioxia in NAND
SK Hynix is weighing closer cooperation with Japan's Kioxia Holdings in NAND flash, extending the strategic message from