SK hynix breaks ground on $4 billion packaging facility in Indiana
The Indiana fab is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029. SK hynix also signed an MOU with Purdue University for research and development collaboration in advanced packaging.
Read original article ↗
Related Articles
Samsung Biologics rights offering highlights future growth, but stock price drops
Samsung Biologics will issue new shares worth 3 trillion won ($2.17 billion) to finance its planned acquisition of a Swi
Hot Chips AI HW wave; HBM vs HBC; capacity buildout; Infineon's latest buy; advanced packaging enablers; foundry report;
AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex
The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with
China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approac