Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue
Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production equipment due from late 2026 through the first quarter of 2027. Chairman I-hsin Tung said recent optical throughput tests exceeded industry benchmarks, with revenue contribution expected in the second half of 2027.
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