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Digitimes September 9, 2026 By DIGITIMES neutral

LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

AI / LLMSemiconductorsManufacturingSupply ChainData Center
<p class="P1" data-start="277" data-end="623">LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks, one of the technology's toughest yield challenges. The move comes as industry forecasts and supplier roadmaps increasingly point to around 2028 as an early window for initial glass-core substrate production.
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