Finding the Fault That Leaves No Trace: Non-Destructive Localization of Opens in Advanced Packaging
<p>An open circuit is one of the hardest failures to find in an advanced package: no current flows, so there's no heat, no photon emission, and often no visible structural defect for X-ray CT or thermography to catch. </p>
<p>The post <a href="https://www.semiconductor-digest.com/finding-the-fault-that-leaves-no-trace-non-destructive-localization-of-opens-in-advanced-packaging/">Finding the Fault That Leaves No Trace: Non-Destructive Localization of Opens in Advanced Packaging</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>
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