Open App →
Back to News Feed
EDN September 9, 2026 By Susan Nordyk neutral

SECO pairs Dragonwing with HMI and SBC

QualcommAI / LLM
<img width="700" height="487" src="https://www.edn.com/wp-content/uploads/Seco-HMI_SBC.jpg?fit=700%2C487" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" loading="lazy" srcset="https://www.edn.com/wp-content/uploads/Seco-HMI_SBC.jpg?w=700 700w, https://www.edn.com/wp-content/uploads/Seco-HMI_SBC.jpg?w=300 300w" sizes="auto, (max-width: 700px) 100vw, 700px" /><p>SECO has developed a 5-in. industrial HMI panel and a compact SBC, both based on the Qualcomm Dragonwing IQ-2390 processor.</p> <p>The post <a href="https://www.edn.com/seco-pairs-dragonwing-with-hmi-and-sbc/">SECO pairs Dragonwing with HMI and SBC</a> appeared first on <a href="https://www.edn.com">EDN</a>.</p>
Read original article ↗

Related Articles

NEURA Robotics and SECO partner to scale humanoid robot production in Europe

German humanoid robotics company NEURA Robotics and Italian embedded computing specialist SECO have announced a strategi

Evertiq · September 9, 2026

Qualcomm to build custom AI inference chips for AWS

Qualcomm's multi-generation agreement to build customized AI inference silicon and optical interconnects for Amazon give

Digitimes · September 9, 2026

Qualcomm and AWS Collaborate on AI Inference Chips and 1.6T Connectivity

SAN DIEGO, Sept. 8, 2026 — Qualcomm Technologies, Inc. today announced a multi-generation collaboration with Amazon to e

HPC Wire · September 8, 2026