Open App →
Back to News Feed
Evertiq September 10, 2026 neutral

Samsung, ASML to collaborate on next-gen chip manufacturing

SamsungASMLAI / LLMSemiconductorsMemoryManufacturing
The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to introduce ASML’s High NA EUV lithography into future DRAM high-volume manufacturing by 2028.
Read original article ↗

Related Articles

Samsung SDS partners with OpenAI and Anthropic in AI push

Samsung SDS used its REAL Summit 2026 to unveil a "multi-dimensional AI full stack" strategy, expanding its AI business

Digitimes · September 10, 2026

Samsung SDS broadens AI push from software to factory robots

Samsung SDS is using its enterprise AI strategy to move beyond office automation and into factory robotics, betting that

Digitimes · September 10, 2026

Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glas

Digitimes · September 10, 2026

Samsung trims foundry partner network as remaining DSPs gain momentum

Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipma

Digitimes · September 10, 2026