Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on
<p class="P1" data-start="446" data-end="749">Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules submitted to TSMC takes longer than expected, pushing back related equipment orders and adding pressure to a commercialization schedule that had already shifted into 2028.
Read original article ↗
Related Articles
Samsung, ASML to collaborate on next-gen chip manufacturing
The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing techno
Samsung SDS partners with OpenAI and Anthropic in AI push
Samsung SDS used its REAL Summit 2026 to unveil a "multi-dimensional AI full stack" strategy, expanding its AI business
Samsung SDS broadens AI push from software to factory robots
Samsung SDS is using its enterprise AI strategy to move beyond office automation and into factory robotics, betting that