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Semiconductor Engineering September 10, 2026 By Huayuan Li neutral

Beyond Thickness: Using Picosecond Ultrasonic Technology For SiCr Process Control In BCD Devices

Semiconductors
<p>Improve visibility into deposition variation by combining thickness metrology with simultaneous reflectivity measurements.</p> <p>The post <a href="https://semiengineering.com/beyond-thickness-using-picosecond-ultrasonic-technology-for-sicr-process-control-in-bcd-devices/">Beyond Thickness: Using Picosecond Ultrasonic Technology For SiCr Process Control In BCD Devices</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>
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