TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders
<p>TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… <a href="https://semiwiki.com/semiconductor-manufacturers/tsmc/373574-tsmcs-cowos-capacity-to-double-by-2028-and-rivals-will-still-win-orders/" class="read-more">Read More </a></p>
<p>The post <a href="https://semiwiki.com/semiconductor-manufacturers/tsmc/373574-tsmcs-cowos-capacity-to-double-by-2028-and-rivals-will-still-win-orders/">TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders</a> appeared first on <a href="https://semiwiki.com">SemiWiki</a>.</p>
Read original article ↗
Related Articles
ESD Alliance Plans Day-Long SEMICON West “Bridging Design and Manufacturing with AI” Design Session
TSMC executive to give keynote address ““Scaling Leadership Silicon with AI” Nine presentations, IEEE-hosted “True Value
FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks
Foxconn Interconnect Technology (FIT) chairman Sidney Lu said AI demand remains strong, with overall capacity near full
TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership
TSMC's planned donation of 12-inch equipment is facing changes as the government adjusts the scope of a semiconductor co