Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move
As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV) roadmaps on a unified 510×515mm format. The tight alignment strongly suggests that Taiwan Semiconductor Manufacturing Co. (TSMC) is eyeing this exact specification for its post-2030 glass substrate platform.
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