Continuity testing in semiconductor ATE: Fundamentals and test methods
<img width="1536" height="1024" src="https://www.edn.com/wp-content/uploads/Fig-1-3.png?fit=1536%2C1024" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" fetchpriority="high" srcset="https://www.edn.com/wp-content/uploads/Fig-1-3.png?w=1536 1536w, https://www.edn.com/wp-content/uploads/Fig-1-3.png?w=300 300w, https://www.edn.com/wp-content/uploads/Fig-1-3.png?w=768 768w, https://www.edn.com/wp-content/uploads/Fig-1-3.png?w=1024 1024w" sizes="(max-width: 1536px) 100vw, 1536px" /><p>Continuity testing is the first test performed in any semiconductor test flow, verifying that a device under test (DUT) is properly connected to automatic test equipment (ATE).</p>
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