Open App →
Back to News Feed
Any Silicon October 6, 2026 By anysilicon neutral

High-end packaging: a market set to nearly quintuple by 2031

AI / LLMSemiconductorsManufacturingSupply Chain
<br /> <br /> Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is forecast to grow to more than $51 billion in 2031, a 27% CAGR during 2025-2031, with package unit volume expanding at a 33% CAGR and wafer demand at 30%. The gap between those three
Read original article ↗

Related Articles

Leonardo DRS starts tactical radar production in the UK

Leonardo DRS has established a new subsidiary, DRS UK, and launched local production of tactical radars in the United Ki

Evertiq · October 6, 2026

Global Youth Powerhouse Summit 2026 Concludes Successfully

US$10 Billion in Venture Capital Convenes to Meet Start-ups Government, Business and Young Professionals Explore Opportu

PR Newswire · October 6, 2026

Greece’s METLEN signs second long-term commercial gallium supply agreement

Multi-national industrial and energy company METLEN Energy & Metals S.A. of Athens, Greece — which operates the only ver

Semiconductor Today · October 6, 2026

100V E-mode GaN-based discrete power transistors.

Renesas has expanded its GaN portfolio into low-voltage applications with its first family of 100V enhancement mode GaN-

Electronics Weekly · October 6, 2026