GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta, New York fab, which GF says will become the first US-based source of silicon interposers supporting advanced packaging.
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