GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
Related Articles
GlobalFoundries to make AI chip component for TSMC in $2B deal
Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York
Globalfoundries to make silicon interposers for TSMC
GlobalFoundries is to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS packaging ecosystem. Under t
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce s
GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components
Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI