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Digitimes October 15, 2026 By DIGITIMES neutral

Samsung, Applied Materials back startup targeting chip packaging warpage

SamsungAI / LLMSemiconductorsManufacturing
Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor packaging deformation before manufacturing. The investment comes as increasingly complex AI chips create new challenges in managing thermal stress, warpage, and manufacturing yields.
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