A Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame)
<p>Researchers at Cadence Design Systems and the University of Notre Dame published “A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling.” Abstract: “Accurate thermal analysis of heterogeneous 2.5D/3D-IC packages is essential yet computationally prohibitive. A single full-package FEM simulation can take hours, while AI-based surrogates treat the entire stack as a monolithic prediction target and... <a class="read_more" href="https://semiengineering.com/a-composable-thermal-solver-for-heterogeneous-2-5d-3d-ic-packages-cadence-notre-dame/">» read more</a></p>
<p>The post <a href="https://semiengineering.com/a-composable-thermal-solver-for-heterogeneous-2-5d-3d-ic-packages-cadence-notre-dame/">A Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>
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