Nvidia's custom HBM pulls Samsung onto TSMC's 3nm process, report says
Nvidia's custom memory design is shifting control of how high-bandwidth memory (HBM) is built from memory makers to its largest customer, and steering a key part of that work to TSMC. Samsung Electronics, which has made every part of its HBM stacks in-house, has agreed after an internal review to use TSMC's 3nm process for the base die of NVHBM, Nvidia's next-generation custom HBM, the <em>Seoul Economic Daily</em> reported on October 18, citing industry sources. The newspaper said it would be the first time the two companies have worked together at the HBM manufacturing stage.
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