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Electronics Weekly October 28, 2026 By David Manners positive

Lam and Imec pursue 3-D integration

MemoryManufacturing
<p>Lam and imec are collaborating to accelerate manufacturing readiness for 3D integration technologies supporting advanced packaging and next-generation memory. By bringing together Lam&#8217;s capabilities in deposition and etch with imec’s [&#8230;]</p> <p>The post <a href="https://www.electronicsweekly.com/news/business/lam-and-imec-pursue-3-d-integration-2026-10/">Lam and Imec pursue 3-D integration</a> appeared first on <a href="https://www.electronicsweekly.com">Electronics Weekly</a>.</p>
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