Doosan Corp. expands in China to boost supply of key materials for AI chips, smartphones

Doosan Corp., a major supplier of core materials for high-tech electronics, is expanding its manufacturing footprint in China to boost production of copper-clad laminates — essential components used in advanced microchips, artificial intelligence servers and smartphones. The company said Friday it signed an investment agreement with Changshu, a city in China's Jiangsu province, to build new copper-clad laminate (CCL) production lines near its existing factory. The agreement was signed Thursday at Suzhou City Hall, with Suzhou Mayor Wang Wei, Doosan President Yoo Seung-woo and Kim In-wook, head of the company's Electronics Business Group, among those in attendance. The project represents the Chinese portion of an investment plan worth approximately 970 billion won (about $670 million), announced by Doosan in September, including approximately 550 billion won earmarked for China. Doosan plans to develop a 185,000-square-meter site near its existing Changshu factory, with investment scheduled to be carried out in stages through 2028. The new production lines are expected to begin operating