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Digitimes September 21, 2026 By DIGITIMES neutral

TSMC builds Kaohsiung hub to speed advanced packaging tests

TSMCAI / LLMSemiconductorsManufacturing
<p class="P1" data-start="2847" data-end="3060">TSMC is building an advanced packaging validation hub in southern Taiwan as rapid chip-on-wafer-on-substrate (CoWoS) expansion puts pressure on equipment and materials suppliers to qualify new technologies faster.
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