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Semiconductor Engineering October 18, 2026 By Technical Paper Link neutral

Thermal Side Channels Create New Security Risks For Autonomous Vehicles (Missouri S&T)

Semiconductors
<p>Researchers at Missouri University of Science and Technology published “Can Autonomous Vehicles Keep Their Cool? A Survey of Thermal Side-Channel and Perception Attacks.” Abstract excerpt: “This survey systematizes thirteen representative works into thermal perception integrity, telemetry leakage, and model-information extraction, comparing them by privilege, timescale, co-tenancy, deployability, and AV relevance. We distinguish attack family from... <a class="read_more" href="https://semiengineering.com/thermal-side-channels-create-new-security-risks-for-autonomous-vehicles-missouri-st/">&#187; read more</a></p> <p>The post <a href="https://semiengineering.com/thermal-side-channels-create-new-security-risks-for-autonomous-vehicles-missouri-st/">Thermal Side Channels Create New Security Risks For Autonomous Vehicles (Missouri S&#038;T)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>
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