Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)
<p>Researchers at Peking University published a technical paper titled “Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements.” Abstract Excerpt: “The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware thermal conductivity (κ) modeling framework. However, generalizable... <a class="read_more" href="https://semiengineering.com/predicting-thermal-conductivity-in-advanced-beol-interconnect-stacks-peking-university/">» read more</a></p>
<p>The post <a href="https://semiengineering.com/predicting-thermal-conductivity-in-advanced-beol-interconnect-stacks-peking-university/">Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>
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